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CVE
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CVE-2018-11976Date: (C)2019-05-31   (M)2023-12-22


ECDSA signature code leaks private keys from secure world to non-secure world in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

CVSS Score and Metrics +CVSS Score and Metrics -

CVSS V3 Severity:CVSS V2 Severity:
CVSS Score : 5.5CVSS Score : 4.9
Exploit Score: 1.8Exploit Score: 3.9
Impact Score: 3.6Impact Score: 6.9
 
CVSS V3 Metrics:CVSS V2 Metrics:
Attack Vector: LOCALAccess Vector: LOCAL
Attack Complexity: LOWAccess Complexity: LOW
Privileges Required: LOWAuthentication: NONE
User Interaction: NONEConfidentiality: COMPLETE
Scope: UNCHANGEDIntegrity: NONE
Confidentiality: HIGHAvailability: NONE
Integrity: NONE 
Availability: NONE 
  
Reference:
https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-11976

CWE    1
CWE-200

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