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CVE
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CVE-2018-11269Date: (C)2018-10-04   (M)2023-12-22


In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.

CVSS Score and Metrics +CVSS Score and Metrics -

CVSS V3 Severity:CVSS V2 Severity:
CVSS Score : 7.8CVSS Score : 7.2
Exploit Score: 1.8Exploit Score: 3.9
Impact Score: 5.9Impact Score: 10.0
 
CVSS V3 Metrics:CVSS V2 Metrics:
Attack Vector: LOCALAccess Vector: LOCAL
Attack Complexity: LOWAccess Complexity: LOW
Privileges Required: LOWAuthentication: NONE
User Interaction: NONEConfidentiality: COMPLETE
Scope: UNCHANGEDIntegrity: COMPLETE
Confidentiality: HIGHAvailability: COMPLETE
Integrity: HIGH 
Availability: HIGH 
  
Reference:
BID-105838
https://www.qualcomm.com/company/product-security/bulletins

CWE    1
CWE-129

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