CVE-2017-18157 | Date: (C)2019-05-09 (M)2023-12-22 |
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
CVSS Score and Metrics +CVSS Score and Metrics -CVSS V3 Severity: | CVSS V2 Severity: |
CVSS Score : 7.8 | CVSS Score : 7.2 |
Exploit Score: 1.8 | Exploit Score: 3.9 |
Impact Score: 5.9 | Impact Score: 10.0 |
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CVSS V3 Metrics: | CVSS V2 Metrics: |
Attack Vector: LOCAL | Access Vector: LOCAL |
Attack Complexity: LOW | Access Complexity: LOW |
Privileges Required: LOW | Authentication: NONE |
User Interaction: NONE | Confidentiality: COMPLETE |
Scope: UNCHANGED | Integrity: COMPLETE |
Confidentiality: HIGH | Availability: COMPLETE |
Integrity: HIGH | |
Availability: HIGH | |
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